Invensas Bonding Technologies (formerly Ziptronix) files an action against Samsung in the U.S. District Court for the District of New Jersey, alleging infringement of six patents relating to the Company’s semiconductor bonding technologies. The patents at issue are U.S. Patent Nos. 7,553,744; 7,807,549; 7,871,898; 8,153,505; 9,391,143; and 9,431,368.