Development of SPICE Compatible Thermal Model of Silicon MEMS Piezoresistive Pressure Sensor for CMOS-MEMS Integration
In this paper, the effects of electrical heating in a silicon MEMS piezoresistive pressure sensor have been analyzed analytically and verified experimentally with a view to design energy efficient sensor node network where the sensors are operated for a prolonged time. For the integration of the MEMS sensor with the CMOS circuits, a SPICE compatible thermal equivalent circuit has been developed for the purpose, which imports the values of thermal resistance, time constant, and thermal capacitance by a dynamically linked library from the external user defined model.