A novel equivalent circuit thermal model for integrated power modules
This paper proposes a new analytical thermal resistance model which provides a specific temperature estimation for integrated power modules. Unlike the conventional two-resistor compact model, two case nodes are introduced into the proposed model to reflect the temperatures of junction and inductor. Multiple heat sources are also included in the model. FEA simulation is applied to evaluate the thermal model and verify that the accuracy of junction temperature estimation is significantly improved. It is noted that reducing thermal resistance between the junction and IC top case node can significantly enhance the cooling performance, which enables flexible methods to modify the thermal performance.