Characteristics of Microstrip Lines through a Metalized EBG Substrate
This paper presents the analysis of a microstrip line surrounded by metalized substrates. The metalized substrates are dielectric substrates with vias through and either with or without patch covers. The guided-wave characteristics are investigated by full-wave electromagnetic simulations with experimental verification. It is found that the metalized substrate would increase the phase constant (slow-wave factor) and decrease the characteristic impedance of a microstrip line. When a microstrip line is in contact with the surrounding vias, the structure is in analogy to a metallic waveguide with a cut-off frequency. The mode properties are also characterized