Application of FIB-SEM and Raman spectroscopy for investigating conductive carbon particles in epoxy encapsulation of IC
We report investigation about three types of conductive carbon particles viz. pure carbon particles, SiO2 filler mixed carbon particles, and SiO2@C core-shell particles in epoxy encapsulations of IC. SEM, EDX, FIB voltage contrast imaging, and Raman spectroscopy are used to characterize conductive carbon particles, and to identify their potential origin.