A low-melting-point alloy filled epoxy conductive adhesives as thermal interface materials
In this paper, we reported the performances of epoxy conductive adhesives filled with a low-melting-point Sn-Bi-Ag alloy. Results revealed the excellent stability, mechanical property of the Sn-Bi-Ag epoxy adhesives. Meanwhile, the thermal conductivity increased by increasing the content of Sn-Bi-Ag filler and 18 W m−1 K−1 can be obtained with 85% Sn-Bi-Ag filler content.