LTCC Vertical Interconnection Modeling by Multi-dimensional Cauchy Approximation
Multidimensional Cauchy approximation is adapted in modeling process to characterize the RF performance of the low temperature co-fired ceramic (LTCC) interconnection structure. The Cauchy approximation function forms a surrogate to express the input and output mapping relation. The parameters of the multi-dimensional Cauchy rational polynomial can be confirmed by solving the convex program problem. A grounded coplanar wave guide (GCPW) vertical interconnection structure model is developed by this method, and the result shows the developed model perform a better predictive performance.