Flip-chip BGA applied high-density organic substrate
In the area of high-end logic devices, high pin counts, high speed and high thermal dissipation are strongly required for packages. A Flip-Chip BGA (FC-BGA) has been developed for such requirements. The FC-BGA has successfully realized up to 1681 pin counts and lower crosstalk noise, by using a high-density organic substrate with the 30 /spl mu/m/30 /spl mu/m line and spacing width rule and optimizing the substrate layer structure. Furthermore, in order to realize a highly reliable package, the Under Bump Metal (UBM) made of Ni/Cu/Ti for eutectic solder bump was developed and the flux-less bonding process was introduced. The FC-BGA packages applied high-density organic substrate has been developed for leading edge logic devices of networking and computing systems.