Hybrid III-V/SOI Optoelectronic Laser Module
We report a compact laser on-chip module that is hybrid integrated with photonic circuits. Arrays of III-V MQW lasers were flip-chip bonded onto an SOI interposer along with micro-machined mirrors for optical coupling into a dedicated grating coupler array. This is a new wafer-scale opto-electronic integration platform enabling photonic links with built-in high efficiency light sources.