Modeling of 3-D Vertical Interconnect Using Support Vector Machine Regression
In this letter, the support vector machine (SVM) regression approach is introduced to model the three-dimensional (3-D) high density microwave packaging structure. The SVM is based on the structural risk minimization principle, which leads to a good generalization ability. With a 3-D vertical interconnect used as an example, the SVM regression model is electromagnetically developed with a set of training data and testing data, which is produced by the electromagnetic simulation. Experimental results suggest that the developed model performs with a good predictive ability in analyzing the electrical performance