An analysis of a case of plastic packaging SiP module delamination failure
In the analysis of plastic packaging SiP product failure, we should not only consider the plastic material and techniques inherent problems, but also the problem that SiP products have a lot of materials, complex structure, and small surface bonding. A type of plastic packaging SiP module function failure after reflow soldering, through appearance inspection, pin electrical characteristic test, X-ray analysis, Scanning Acoustic Microscope(SAM) examination and longitudinal section inspection and so on. We found that due to the compact structure, the design refers to the bonding finger with a small distance from the bare die, resulting in a small amount of adhesive film and forming a hole. In addition to improper selection of adhesive, the conductive adhesive after curing is relatively brittle and hard. It is not conducive to large chip resistance stress, resulting in plastic devices after moisture absorption during reflow soldering. The internal Vapor thermal expansion leads to delamination and failure.