A Method of Thermal Analysis for CMOS Integrated Circuit
The paper presents a method for thermal analysis of integrated circuit, which combines a SPICE tool (HSPICE) with a finite element analysis tool (ANSYS). Since the connection between the two simulators is not so smooth, LinkCAD for ANSYS that provides seamless integration of the ANSYS products with the CAD environment is used in our work. By this method, thermal analysis of a general integrated circuit is accurately presented with the consideration of key sources of power dissipation and their temperature relation in CMOS IC