Modeling and evaluation for electrical characteristics of through-strata-vias (TSVS) in three-dimensional integration
This paper discusses through-strata-vias (TSVs) technology and presents modeling results of their electrical performance using Agilent's ADS and Momentum simulator. Since TSV is an essential component in three-dimensional (3D) integration/packaging, it is important to explore and investigate its electrical characteristics. A simple face-to-back TSV is studied in frequency domain and time domain. The impact of physical configurations and materials on TSV electrical characteristics is evaluated. An equivalent circuit model is proposed, and the values of passive elements (resistance, inductance and capacitance) within the model are extracted from full-wave scattering parameters.