Area optimization in deep sub-micron VLSI design
Area is an important factor in deep sub-micron VLSI design. In order to save die size during back-end design for our DSP microprocessor - SuperV, double metal power rings were designed, and some standard cells were also put under the horizontal power straps. In this way, more than 12% die size saved. Other optimization methods were also introduced to save area during placement and routing. Finally, the core area is shrank to 4mm times 4mm, and the chip's area is decreased to 5mm times 5mm including the bonding pads