3D packaging based 4-channel LTCC receiver module
A 3D packaging based 4-channel X-band receiver module is implemented using low temperature co-fired ceramic (LTCC) technology. A dual-mode X-band bandpass filter (BPF), an lumped-element branch-line coupler and an lumped BPF is proposed for the receiver module, respectively. The overall size of the module is only 54 mm × 60 mm × 1 mm. The measured gain parameter, noise figure (NF), image rejection and isolation between adjacent channels is better than 51 dB, 2.5 dB, 37 dB and 35 dB, respectively.