Demonstration of high quality and low loss millimeter wave passives on embedded wafer level packaging platform (EMWLP)
With the increasing demand for system integration to cater for continuously increasing I/Os as well as higher operating frequencies, EMWLP is emerging as a promising technology for integration. This platform allows integrated passives to be designed in the redistribution layers using the mold compound as a substrate, which significantly improves the passives performance compared to those of on-chip. In this paper, we present the results of high quality passives on EMWLP platform that are benchmarked against high resistivity silicon (HiRSi). The passives were then demonstrated in two band pass filters targeted to operate in the IEEE 802.11a band, with electrical performances comparable to that of commercial IPDs. Using the same platform, the measured loss characteristics of transmission lines up to 110 GHz is reported. We also demonstrate for the first time a low loss narrowband 77-GHz band pass filter on EMWLP platform, with a good correlation obtained between simulation and measurement results.