Fluidic self-assembly of InGaAs vertical cavity surface emitting lasers onto silicon
Vertical cavity surface emitting lasers (VCSELs) have been successfully integrated by fluidic self-assembly (FSA) into 10 /spl mu/m deep holes etched into an Si substrate. These 40/spl times/40/spl times/10 /spl mu/m/sup 3/ devices were fully planarised and metallised after integration. The VCSELs operated pulsed at O.98 /spl mu/m with a threshold current as low as 75 mA and a turn-on voltage of 2.9 V.