MEMS packaging on a budget (fiscal and thermal)
MEMS packaging poses novel constraints as compared to conventional IC packaging, and accounts for up to 80% of the cost of the device. A new type of package is proposed, addressing the problems of hermeticity and die singulation, as well as an alternative means of MEMS-IC integration. An organic-free, metal-to-metal bond process enables hermetic sealing at low temperatures. The package has been demonstrated with inertial, resonant, and RF MEMS.