A breakthrough in power electronics reliability — New die attach and wire bonding materials
Power Electronics on DCB are used for high power devices. There is a wide field of applications for such power electronic devices like converters or inverters for wind mills, solar parks or for electric and hybrid vehicles. High efficiency, long life time and increased power density are the major technical requirements for those devices. Especially the life time, but also the power density are limited by die attach and wire bond materials. New material solutions to overcome these limitations in life time will be discussed in this paper. Results of an active power cycling test of DCB devices supported by the failure analysis and material data will be used to demonstrate and explain the novel materials advantages versus conventional solutions.