Integration of fluidically self-assembled optoelectronic devices using a silicon-based process
Fluidic self-assembly (FSA) is a technique for efficient wafer-scale placement of large numbers of small or microscopic devices into receptor sites etched in a substrate. This paper reports the first complete planar process for integrating optoelectronic devices on a silicon wafer using fluidic self-assembly. Methods for bonding the devices into the receptor sites and subsequently contacting, planarizing, and interconnecting them are outlined.<<ETX>>