An image pixels based fast matching algorithm for Die Bonder targeting
Auto Die Bonder (ADB) is often encountered in the IC package field, whose key technical difficulty lies in quickly and accurately locating the bonding positions of the chips. In this paper, a normalized cross correlation (NCC) algorithm based on image pixels has been used to address this problem. By using iterated algorithm with simplified expression, the modified NCC (MNCC) is remarkably accelerated compared to the traditional one. Afterwards, the MCNN algorithm has been examined by experiments to locate the lead-frame pads, and the result shows its superiority in efficiency with satisfactory positioning accuracy.