Thermal layout optimization of stacked chips based on hybrid algorithm of simulated annealing and particle swarm
As the density of chip package increases, the thermal layout optimization of stacked chips has become more and more important. The thermal layout optimization of stacked chips is studied in this paper. Firstly, a hybrid algorithm of simulated annealing and particle swarm (SA-PSO) is proposed for thermal layout optimization. Secondly, the fitness function is obtained based on thermal superposition model and heat conduction equation. Then the temperature of chips is chosen as the evaluation index and the corresponding optimization scheme is achieved. Finally, finite element analysis (FEA) software is used to evaluate the thermal field distribution of stacked chips and the result shows the temperatures of stacked chips are lowered after optimization. Thus, we can prove that the chip layout optimization algorithm proposed in this paper is effective and robust in thermal layout optimization of stacked chips.