A CMOS TDI readout circuit for infrared focal plane array
A new structure 288 × 4 CMOS time delay and integration (TDI) readout integrated circuit (ROIC) is presented in this paper. The TDI function is implemented using an integration and storage circuit array and a charge amplifier with the advantages of low power and compact layout. An experimental chip has been designed and fabricated in 0.5 ¿m double-poly-three-metal CMOS technology. Bi-directional TDI, defective element deselection and two-gain option (1.015 pC/2.03 pC) functions have been realized in the experimental chip and measurement results at liquid nitrogen temperature indicated that all functions were correct and performance satisfied the requirement of long waveform IRFPA. The readout speed of each out can reach 5 MHz and the dynamic range is 75.6 dB.