Decoupling capacitor modeling and characterization for power supply noise in 3D systems
Decoupling capacitors are essential to reduce high transient current noise and to provide a low impedance power delivery path. 3D technology has several advantages for power delivery, and this work investigates the impacts of decoupling capacitors on through-silicon-via (TSV)-based 3D power networks using a novel hybrid modeling approach, i.e., combining electromagnetic (EM) and SPICE simulations. We first partitioned a 3D system into a number of components, extracted the RLGC parasitics for each decomposed physical element, and imported them into an assembled system-level equivalent circuit. Through comparing and analyzing the effectiveness of several decoupling strategies, design tradeoffs are made in selecting the proper values and placement of decoupling capacitors to ensure optimal power distribution solution in 3D architectures.