Study on electro-thermo-mechanical responses of bonding wires arrays used for the package design of LDMOSFET-based RF Amplifier
This paper presents the study of electro-thermo-mechanical responses of bonding wire arrays used for the design of lateral double-diffused MOSFET-based RF amplifier. We at first show a series of ruggedness measurements of bonding wire arrays with a mismatch control system and an IR microscopy used for accurately predicting their surface temperatures. Further, an in-house time-domain finite element solver is employed for simulating the electro-thermo-mechanical responses of bonding wire arrays and their highest temperatures are captured and validated in comparison with those of commercial simulator COMSOL. Finally, an improved design of the bonding wire array is proposed and validated experimentally so as to get both uniform current and temperature distributions, and therefore, a significant improvement of the electrical performance of LDMOSFET RF PA is achieved as we expected.