High efficient Pd-based bimetallic alloyed catalyst for Electroless deposition of metallic copper
The ECD have been considered critical process for PCB industry, yet the catalysts with high performance are of great importance in this process. In this work, PdCu bimetallic alloyed catalyst for Electroless copper deposition (ECD) were proposed by reducing the mixed metallic precursor with a simple hydrothermal method. The tunable Pd/Cu ratio plays key role of the morphologies and the electro-catalytic activity. The as-prepared PdCu catalysts Pd1Cu1.5 exhibits enhanced activity and high mass current density (about 576mA mgPd-1) as well as high efficiency of ECD.